JPS609663A - 不織布研摩材 - Google Patents
不織布研摩材Info
- Publication number
- JPS609663A JPS609663A JP11673183A JP11673183A JPS609663A JP S609663 A JPS609663 A JP S609663A JP 11673183 A JP11673183 A JP 11673183A JP 11673183 A JP11673183 A JP 11673183A JP S609663 A JPS609663 A JP S609663A
- Authority
- JP
- Japan
- Prior art keywords
- abrasive
- nonwoven fabric
- abrasive grains
- convex
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004745 nonwoven fabric Substances 0.000 title claims abstract description 22
- 239000006061 abrasive grain Substances 0.000 claims abstract description 24
- 239000011230 binding agent Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims abstract description 7
- 238000004049 embossing Methods 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims abstract description 5
- 229920002994 synthetic fiber Polymers 0.000 claims abstract description 4
- 239000012209 synthetic fiber Substances 0.000 claims abstract description 4
- 239000003082 abrasive agent Substances 0.000 claims description 7
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 239000000835 fiber Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 5
- 229920003002 synthetic resin Polymers 0.000 abstract description 3
- 239000000057 synthetic resin Substances 0.000 abstract description 3
- 230000001154 acute effect Effects 0.000 abstract description 2
- 238000005470 impregnation Methods 0.000 abstract description 2
- 229920001169 thermoplastic Polymers 0.000 abstract description 2
- 239000004416 thermosoftening plastic Substances 0.000 abstract description 2
- 101100495256 Caenorhabditis elegans mat-3 gene Proteins 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000002131 composite material Substances 0.000 description 5
- 239000004744 fabric Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000004677 Nylon Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229920000459 Nitrile rubber Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004816 latex Substances 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11673183A JPS609663A (ja) | 1983-06-27 | 1983-06-27 | 不織布研摩材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11673183A JPS609663A (ja) | 1983-06-27 | 1983-06-27 | 不織布研摩材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14861588A Division JPH01109085A (ja) | 1988-06-16 | 1988-06-16 | 不織布研摩材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS609663A true JPS609663A (ja) | 1985-01-18 |
| JPH0355272B2 JPH0355272B2 (en]) | 1991-08-22 |
Family
ID=14694392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11673183A Granted JPS609663A (ja) | 1983-06-27 | 1983-06-27 | 不織布研摩材 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS609663A (en]) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154668U (en]) * | 1985-03-19 | 1986-09-25 | ||
| JPS6391362U (en]) * | 1986-12-01 | 1988-06-13 | ||
| US4822536A (en) * | 1985-12-20 | 1989-04-18 | U.S. Philips Corporation | Method of encapsulating an electronic component with a synthetic resin |
| JPH01109085A (ja) * | 1988-06-16 | 1989-04-26 | Kanai Hiroyuki | 不織布研摩材 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS584361A (ja) * | 1982-06-11 | 1983-01-11 | Sanko Giken:Kk | 研摩布の製造方法 |
-
1983
- 1983-06-27 JP JP11673183A patent/JPS609663A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS584361A (ja) * | 1982-06-11 | 1983-01-11 | Sanko Giken:Kk | 研摩布の製造方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61154668U (en]) * | 1985-03-19 | 1986-09-25 | ||
| US4822536A (en) * | 1985-12-20 | 1989-04-18 | U.S. Philips Corporation | Method of encapsulating an electronic component with a synthetic resin |
| JPS6391362U (en]) * | 1986-12-01 | 1988-06-13 | ||
| JPH01109085A (ja) * | 1988-06-16 | 1989-04-26 | Kanai Hiroyuki | 不織布研摩材 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0355272B2 (en]) | 1991-08-22 |
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